Technical details

Materials that are chemically milled :

  • Aluminum
  • Brass
  • Chrome
  • Copper
  • Beryllium Copper
  • Nickel Copper
  • Inconel
  • Monel
  • Nickel Silver
  • Ni chrome
  • Phosphor Bronze
  • Steels
  • Spring Steel
  • Stainless Steel
  • Silver
  • Zinc

Photo resists

We use a range of DuPont dry film resists - Riston 215,220 & fx930.
Also, for liquid negative resists, we have a Cirgraphics dip coater.


Maximum exposure size 3 meters×0.5 meters.
High resolution is a minimum 25 micron track with 50 micron gap.
Equipment: 0.6×0.6 Cirgraphics 3000 & 3 metre long Cirgraphics exposure unit.


The etch chemistry is Ferric Chloride with additives- we use 3 standard solutions.
Equipment: Adam Pills spray etch - Development, Etch and Stripping modules.

Cover Layer

For flexible circuit encapsulation with polyimide (kapton) we have an Italpress
with active press area 1.2 meters×0.5 meters with a maximum temperature of 350 degrees C.