Technical details

Materials that are chemically milled :

• Aluminum
• Brass
• Chrome
• Copper
• Beryllium Copper
• Nickel Copper
• Inconel
• Monel
• Nickel Silver
• Ni chrome
• Phosphor Bronze
• Steels
• Spring Steel
• Stainless Steel
• Silver
• Zinc

Photo resists

We use a range of DuPont dry film resists - Riston 215,220 & fx930.
Also, for liquid negative resists, we have a Cirgraphics dip coater.

Exposure

Maximum exposure size 3 meters×0.5 meters.
High resolution is a minimum 25 micron track with 50 micron gap.
Equipment: 0.6×0.6 Cirgraphics 3000 & 3 metre long Cirgraphics exposure unit.

Etch

The etch chemistry is Ferric Chloride with additives- we use 3 standard solutions.
Equipment: Adam Pills spray etch - Development, Etch and Stripping modules.

Cover Layer

For flexible circuit encapsulation with polyimide (kapton) we have an Italpress
with active press area 1.2 meters×0.5 meters with a maximum temperature of 350 degrees C.